COB is unstoppable, Hongli Optoelectronics pushes the index of 95 products

At present, there are two main types of flip-chip COB devices on the market: the first is a flip-chip CSP chip combined with a super-thermally conductive aluminum substrate or a ceramic substrate; the second is a flip-chip blue chip combined with a super-thermally conductive aluminum substrate or a ceramic substrate. The former process is extremely simplified and the production efficiency is high. However, the color and color consistency is poor; while the latter has good light color consistency, and the process is relatively mature and easy to implement.

The high optical density flip-chip COB introduced by Hongli Optoelectronics adopts the second process and introduces an advanced phosphor deposition process, which can effectively improve the concentration and reduce the temperature of the rubber surface. At the same time, combined with ultra-high thermal conductivity materials, the reliability of the product is improved. Recently, according to the person in charge of Hongli Optoelectronics related technology, the company launched high-density density flip-chip COB series products have entered the mass production stage, respectively, aluminum nitride 1818 (LC003), 1313 (LC004). The power can cover 15~80w, the color rendering index is greater than 80, and the maximum can be greater than 95.

For the new products introduced, in order to ensure the reliability and stability of its batch products, Hongli Optoelectronics is unequivocal in verifying the reliability of the products, and always speaks with data. This high-density, flip-chip COB has a lifespan retention rate of over 98% after 2000 hours of power-on experiments. Hongli Photonics Lab has LM-80 aging equipment and is an Energy Star Laboratory accredited by CNAS and authorized by the US Environmental Protection Agency (EPA).

Hongli Optoelectronics believes that COB will have its own unique market space in the future technology. The core part of the technology breakthrough is in the substrate and related packaging materials, and the other part is the packaging structure design with more cost-effective advantages. Therefore, in the technical development of COB packaging products, Hongli Optoelectronics has always been carried out around new materials and new processes, which also makes the company's COB devices have excellent performance in terms of performance, reliability and photoelectric parameters. Hongli's COB LEDs with 9W/25W/100W power respectively have obtained the third-party LM-80 7000-hour test report and have perfect patent protection.

New Product

LC003 product power range 30-80W

Corresponding light efficiency 105 lm/w, 98 lm/w, 89 lm/w

LC004 product power range 15-50W

Corresponding light efficiency 100 lm/w, 92 lm/w, 85 lm/w

Product features: product features

1. High power, high optical density, small light emitting surface;

2, the power can cover 15 ~ 80W;

3, the main push light surface φ11.2mm, φ14mm;

4, the color rendering index is greater than 80, the maximum can be greater than 95;

5, with a good narrow angle light design conditions;

6, compatible with common lighting accessories;

7, low thermal resistance package design, thermal resistance <0.2 ° C / W;

8, no gold wire, flip eutectic, no dead light risk;

9, high reliability, high temperature and high humidity (double 85) power-on experiment 2000h hour life maintenance rate of more than 98%;

10. It has a number of patent protections covering its product structure design and process methods.

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