Osram and Toyoda Gosei sign LED patent agreement

Two major LED makers have agreed to share patented technologies related to blue LED chip fabrication, industrial production of LEDs and semiconductor lasers, and white LEDs. Toyoda Gosei Ltd, a major LED maker based in Aichi, Japan, and Osram GmbH, a German LED Maker, have signed an agreement for the mutual use of patents for certain LED and laser technologies.
Cooperation relates to indium gallium nitride (InGaN) semiconductor technologies that form the basis for laser diodes and LEDs in white, blue and green.
From Osrams side, this mainly contributions basic technologies for the industrial production of LEDs and semiconductor lasers, and patents for white LEDs. Toyoda Gosei, which first developed blue nitride-based LEDs in 1991, possesses protected know-how relating to blue LEDs.
The companies say that the agreement will make it much easier for both of them to develop, manufacture and market new products without fear of unintentional patent violations. The two companies say that they are looking forward above all to considerable and speedy improvements in the luminous intensity Of LEDs.
An Osram spokesperson confirmed to LEDs Magazine that the agreement does not include Lexedis Lighting, which is a joint venture between Toyoda Gosei and Tridonic Optoelectronics.
Ruediger Mueller, CEO of Osram Opto Semiconductors described the agreement as a prime example of respectful and responsible dealings with the intellectual property of other companies ?C with benefits for both the market and customers.
Our cooperation with Toyoda Gosei, one of the worlds most innovative LED manufacturers, will help make LED technology more available and will enable the infant market for LED products to develop in a spirit of fair competition, said Mueller.
Osram is proud of its forthright patent policy in the LED market, and says that it relentlessly pursues any infringements of its patent rights. At the same time, Osram has entered a large number of license agreements with other companies for the use of Osram patents and For the exchange of patents.

TO-220 package

TO-220 Transistor Outline Package is a type of in-line package often used in high-power transistors and small and medium-sized integrated circuits.

It not only plays the role of mounting, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects to the pins of the package shell with wires through the contacts on the chip, and these pins pass through the wires on the printed circuit board. Connect with other devices to realize the connection between the internal chip and the external circuit.Because the chip must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance degradation. On the other hand, the packaged chip is also easier to install and transport.

TO-220 package is a kind of in-line package that is often used for fast recovery diodes. TO-220AC represents a single tube with only two pins and only one chip inside.

The diodes are packaged in TO-220AC and can be used in switch mode power supplies (SMPS), power factor correction (PFC), engine drives, photovoltaic inverters, uninterruptible power supplies, wind engines, train traction systems, electric vehicles and other fields.



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