With the rapid development of science and technology, the awareness of global environmental protection has risen in recent years. How to effectively develop energy-saving and energy-saving technology products has become a trend today. As far as the LED industry is concerned, it has become one of the fast-growing emerging industries in the past few years. In the 2010 China World Expo, it can be seen that LED technology is more brilliant, from upstream to downstream manufacturing, every link It is a very important role.
The luminous efficiency of LEDs will continue to decrease with the increase of the use time and the number of applications. The excessive junction temperature will accelerate the color temperature degradation of the LED illumination, so the junction temperature is inversely proportional to the LED illumination. relationship. In addition, with the increase of LED chip size and the development of polycrystalline LED package design, the thermal load of LED carrier board is also doubled. In addition to the heat dissipation capability of the carrier material, the thermal stability of the material will affect the life of the LED product. . To put it simply, the carrier material of high-power LED products needs to have both high heat dissipation and high heat resistance, so the material of the package substrate becomes a key factor.
In the application of traditional LED heat-dissipating substrate, the application range of Metal Core PCB (MCPCB) and ceramic heat-dissipating substrate is different. MCPCB is mainly used in system circuit board, ceramic heat-dissipating substrate is applied to LED chip substrate, however, with LED The evolution of demand, both of which are gradually applied to the COB (Chip on Board) process, will be further discussed and compared for the two materials.
MCPCB
MCPCB is mainly evolved from the early copper foil printed circuit board (FR4). The biggest difference between MCPCB and FR4 is that MCPCB uses metal as the core technology and uses aluminum or copper metal as the substrate of the circuit board. A layer of copper foil or copper plate metal plate is attached to the substrate as a circuit to improve problems such as poor heat dissipation. The structure of the MCPCB is shown in Figure 1:
Figure 1 MCPCB structure diagram
Because aluminum metal itself has good ductility and heat conduction, combined with the high thermal conductivity of copper metal, it is reasonable to have a very good heat conduction / heat dissipation effect.
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