[Text|High-tech LED reporter Wen Zhao] 2014 is a year of turbulent flow. The words "integration year", "channel year" and "lighting first year" reflect the golden age of LED. In this blockbuster with LED background, there are laughter and tears filled with sorrow and sorrow.
Winning the Nobel Prize, let the LED industry people exalted; NVC lighting storm, affecting the nerves of the industry; Tmall e-commerce rises, a wave of O2O boom; Xiaomi Ali cross-border robbery, so that everyone can not afford to hurt; integration Mergers and acquisitions of the vibration industry chain, light songs and dancers have it, long songs when the cryers are more...
With the LED industry, there are always endless changes and challenges, because the development of technology such as light efficiency, light quality and reliability is changing with each passing day, and every year is constantly evolving, and new technologies are slowly emerging from incubation. .
When talking about how companies can cope with such changes and challenges, Lu Xueeds (“亮é”â€) Asia Regional Marketing Director Zhou Xuejun emphasized that different companies have different market positioning, different capabilities, and different situations. The resources are different, so it is difficult to say a one-size-fits-all rule. Lumileds is the market leader in LED devices, but not everyone is a market leader, many of which are just market followers, and market followers need to develop market follower strategies. "Know yourself, eat and eat. When you want everything, if you want to be anything, then you are nothing."
LED is essentially an electronic product. It must be groundbreaking and inseparable from innovation. Zhou Xuejun analyzed the future direction of LED innovation from the aspects of substrate, DROOP (light reduction), package innovation (CSP) and modularization and performance roadmap. . He said: "The industrial characteristics of LED will become more and more prominent, and the new packaging form will change the competitive landscape."
In Zhou Xuejun's view, in the past two years, the continuous advancement of packaging technology has led to continuous improvement in LED performance. Zhou Xuejun believes that in the future, LED devices must be smaller and smaller, material costs will be lower and lower, and lamps will gradually become lighter and thinner. The evolution of LED packaging is similar to that of traditional semiconductor packaging. From large to small, from small to miniaturized, the integration will be higher and higher.
Speaking of medium-power LEDs, Zhou Xuejun said that the products of low- and medium-power LEDs are relatively mature, but the competition in this field is very fierce. If you want to provide a full range of services, you must provide a wide variety of package forms. To meet different lighting needs, because the lighting industry itself is very complicated. He also said that the next-generation LED package will exhibit the following features: higher lumen output, single-point color conversion, wide-area color coverage, and precise color point control.
For the miniaturization of LED devices, Zhou Xuejun mentioned the more popular chip-scale package (CSP), chip-level package can reduce the material cost of 40% to 50%, the volume becomes smaller, and the heat dissipation will be better. Therefore, the future trend of high-power LED chips will be chip-level packaging, chip-level packaging will also drive down the cost, withstand higher drive power, improve lumens per watt.
Zhou Xuejun said that the distinction between the middle-power LED and the high-power LED in the future will not be obvious. Future chips will also offer different flexibility to the design of the luminaire. The same luminaire has different requirements for the chip in different occasions. If it is necessary to ensure a certain cost and maintain high reliability, the CSP method can be adopted. If the general household lighting is used, the general packaging method can be used, so that the product can be easily separated.
Therefore, in the future packaging industry trends, various package forms will continue to coexist for a long time, they will maintain their respective characteristics and applications. Zhou Xuejun hopes that the future LED industry is not a competition to the bottom of the valley, but a competition to climb the peak. No matter how the future trend changes, how to reduce the cost of the enterprise, the pursuit of light quality will never change.
The 13th Gaogong LED Industry Summit Forum will be held in Langham, Guangzhou on June 8th. At that time, Zhou Xuejun will give a wonderful speech on the theme of "Innovative Road of LED Lighting", and discuss with you how the LED industry will go in the future.
Winning the Nobel Prize, let the LED industry people exalted; NVC lighting storm, affecting the nerves of the industry; Tmall e-commerce rises, a wave of O2O boom; Xiaomi Ali cross-border robbery, so that everyone can not afford to hurt; integration Mergers and acquisitions of the vibration industry chain, light songs and dancers have it, long songs when the cryers are more...
With the LED industry, there are always endless changes and challenges, because the development of technology such as light efficiency, light quality and reliability is changing with each passing day, and every year is constantly evolving, and new technologies are slowly emerging from incubation. .
When talking about how companies can cope with such changes and challenges, Lu Xueeds (“亮é”â€) Asia Regional Marketing Director Zhou Xuejun emphasized that different companies have different market positioning, different capabilities, and different situations. The resources are different, so it is difficult to say a one-size-fits-all rule. Lumileds is the market leader in LED devices, but not everyone is a market leader, many of which are just market followers, and market followers need to develop market follower strategies. "Know yourself, eat and eat. When you want everything, if you want to be anything, then you are nothing."
LED is essentially an electronic product. It must be groundbreaking and inseparable from innovation. Zhou Xuejun analyzed the future direction of LED innovation from the aspects of substrate, DROOP (light reduction), package innovation (CSP) and modularization and performance roadmap. . He said: "The industrial characteristics of LED will become more and more prominent, and the new packaging form will change the competitive landscape."
In Zhou Xuejun's view, in the past two years, the continuous advancement of packaging technology has led to continuous improvement in LED performance. Zhou Xuejun believes that in the future, LED devices must be smaller and smaller, material costs will be lower and lower, and lamps will gradually become lighter and thinner. The evolution of LED packaging is similar to that of traditional semiconductor packaging. From large to small, from small to miniaturized, the integration will be higher and higher.
Speaking of medium-power LEDs, Zhou Xuejun said that the products of low- and medium-power LEDs are relatively mature, but the competition in this field is very fierce. If you want to provide a full range of services, you must provide a wide variety of package forms. To meet different lighting needs, because the lighting industry itself is very complicated. He also said that the next-generation LED package will exhibit the following features: higher lumen output, single-point color conversion, wide-area color coverage, and precise color point control.
For the miniaturization of LED devices, Zhou Xuejun mentioned the more popular chip-scale package (CSP), chip-level package can reduce the material cost of 40% to 50%, the volume becomes smaller, and the heat dissipation will be better. Therefore, the future trend of high-power LED chips will be chip-level packaging, chip-level packaging will also drive down the cost, withstand higher drive power, improve lumens per watt.
Zhou Xuejun said that the distinction between the middle-power LED and the high-power LED in the future will not be obvious. Future chips will also offer different flexibility to the design of the luminaire. The same luminaire has different requirements for the chip in different occasions. If it is necessary to ensure a certain cost and maintain high reliability, the CSP method can be adopted. If the general household lighting is used, the general packaging method can be used, so that the product can be easily separated.
Therefore, in the future packaging industry trends, various package forms will continue to coexist for a long time, they will maintain their respective characteristics and applications. Zhou Xuejun hopes that the future LED industry is not a competition to the bottom of the valley, but a competition to climb the peak. No matter how the future trend changes, how to reduce the cost of the enterprise, the pursuit of light quality will never change.
The 13th Gaogong LED Industry Summit Forum will be held in Langham, Guangzhou on June 8th. At that time, Zhou Xuejun will give a wonderful speech on the theme of "Innovative Road of LED Lighting", and discuss with you how the LED industry will go in the future.
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