Jingke Electronics' “National Tour Conference for Chip-level LED Lighting Solutions†will arrive in Chengdu on April 10th and will be held in the 13th China Chengdu International Lighting Exhibition.
It is understood that the conference will be shared by Jingke Electronics' senior engineers and R&D supervisors on the "Easy Second Generation and Easy Series General Lighting Products and Application Solutions", "Metal Based COB/Chip Level Ceramic Based COB New Products and Total Solutions "At that time, Jingke Electronics' partners will also give a wonderful speech around the overall solution of LED lighting.
As the core chip and light source product manufacturer in the middle and upper reaches of the LED industry chain, Jingke Electronics has launched the “chip-level LED lighting overall solutionâ€, which can complete some traditions in the LED chip manufacturing process through a new wafer-level process. The packaging process or the traditional packaging process saves the final package size of the LED and the performance is more stable. For the flip-chip process, the chip-level light source can avoid the use of traditional die-bonding and wire bonding processes to achieve gold-free wire development, and performance and cost performance are better under reliability and high current impact.
It is understood that the conference will be shared by Jingke Electronics' senior engineers and R&D supervisors on the "Easy Second Generation and Easy Series General Lighting Products and Application Solutions", "Metal Based COB/Chip Level Ceramic Based COB New Products and Total Solutions "At that time, Jingke Electronics' partners will also give a wonderful speech around the overall solution of LED lighting.
As the core chip and light source product manufacturer in the middle and upper reaches of the LED industry chain, Jingke Electronics has launched the “chip-level LED lighting overall solutionâ€, which can complete some traditions in the LED chip manufacturing process through a new wafer-level process. The packaging process or the traditional packaging process saves the final package size of the LED and the performance is more stable. For the flip-chip process, the chip-level light source can avoid the use of traditional die-bonding and wire bonding processes to achieve gold-free wire development, and performance and cost performance are better under reliability and high current impact.
Jingke Electronics "Chip-level LED lighting overall solution national tour conference" Shenzhen station site
Jingke Electronics "Chip-level LED lighting overall solution national tour conference" on-site product display
According to Zhang Mingsheng, Jingke Electronics will continue to develop in the field of backlights in 2013. At the same time as the professional field of packaging backlights, in order to have a greater application in the market, Jingke Electronics will enter the market. Lighting field.
(This article is the electronic submission of Jingke)
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