Congatec Introduces Ultrathin Industrial Grade Motherboard Based on 7th Generation Intel® CoreTM U Processor
IoT-connected devices
High CP ultra-thin motherboard solution!
Shanghai, China, March 09, 2017 * * * Leading technology embedded computer modules, single board computer (SBCs) and EDMS customized service leader - Konkat Technology of Germany, introduced the ultra-thin industrial-grade master version of the conga-IC175, Based on the new 7th generation Intel® CoreTM U Kaby Lake processor for Internet of Things (IoT) connected devices. The module is particularly suitable for space-constrained, high-performance, low-power Internet of Things (IoT) designs. In addition to the new generation of processor performance enhancements, the module also offers comprehensive IoT support, including SIM card slots for 3G/4G or narrowband (2G) connections and the first version of the Konka IoT API. The board will be debuted at the German Embedded Expo. (Booth No: Hall 1, Booth 358)
The ultra-flat design of Congatec's new Thin Mini-ITX industrial master is perfect for ultra-thin system designs such as industrial GUIs/HMIs, digital signage systems, point-of-sale terminals and medical tablets. The board provides ultra-fast Intel® Optane® storage technology via M.2 connectors for ultra-fast system boot, application launch, video recording and processing, and software updates. This board further supports Hyper-Threading technology, which uses RTS real-time management program to convert dual-core designs into four-in-one systems.
“Our new Thin Mini-ITX Master Edition can be used in a wide range of embedded and Internet of Things (IoT) applications. It is powered by a high-end 64-bit Intel® CoreTM processor and provides 15 watts of highly configurable thermal design power. Consumption (cTDP), with flexible power consumption from 7.5W cTDP to 25W cTDP, represents an excellent balance of power and performance, explains Martin Danzer, Conga Product Management Director. Designed specifically for the embedded and rugged industrial market, the flagship motherboard design offers at least 7 years of long-term availability and a comprehensive set of industrial interfaces and drivers. Thanks to the integrated support of Konka specialists, the design phase can be highly simplified and can be an easy job for OEM engineers.
Detailed Functional Features The new industrial-grade conga-IC175 Thin Mini-ITX motherboard offers four different versions of the seventh-generation dual-core Intel® CoreTM U SoC processors and supports 7.5 W to 25 W of configurable cTDP. Two SO-DIMM slots support up to 32 GB of DDR4-2133 memory. For non-volatile storage, the board provides 1xM.2 slots that support the new Intel® Optane® storage technology, dramatically reducing latency and increasing data rate for large storage devices. Two SATA3.0 interfaces support the connection of additional HDDs or SSDs. The board supports DirectX 12 Intel® Gen 9 HD Graphics 620 with 2x DP++ plus eDP or dual channel LVDS supporting up to 3 separate displays (4k resolution @ 60 Hz).The 10-bit hardware accelerated encoding/decoding of the new HEVC and VP9 is not loaded on the processor, and HDR support makes the image more vivid and vivid. Industrial I/O ports include 2 Gigabit Ethernet and 1 SIM card slot for 3G/4G or narrowband M2M and IoT connections, 1 PCIe x4 and 1 mPCIe for general purpose expansion, 4 USB 3.0, 6 USB 2.0, 8 GPIO, and 2 serial COM ports - one of which can be configured for ccTalk. An integrated board management controller, HDA audio includes stereo amplifiers, a MIPI CSI-2 interface that can be directly connected to a low-cost CMOS camera, and optional TPM2.0 for complete I/O functionality. The board supports 64-bit versions of Microsoft Windows 10 and Windows IoT and commonly used Linux operating systems. Konka also offers comprehensive additional options to simplify the design phase, including thermal solutions, I/O shielding and cable kits.
The new conga-IC175 Thin Mini-ITX motherboard offers the following processor versions:
Processor
Cores / Threads
Intel® Smart Cache [MB]
Clock / Burst
[GHz]
TDP
[W]
Graphics
Intel® CoreTM i7-7600U
2/4
4
2.8/3.9
15/7.5
Intel® HD Graphics 620
Intel® CoreTM i5-7300U
2/4
3
2.6/3.5
15/7.5
Intel® HD Graphics 620
Intel® CoreTM i3-7100U
2/4
3
2.4
15/7.5
Intel® HD Graphics 620
Intel® Celeron® 3695U
2/2
2
2.2
15/10
Intel® HD Graphics 610
More Konka Industrial Thin Mini-ITX Motherboard Details: http://
Beijing Zhihuilian is the most important partner of Congatte China in China. Responsible for marketing and technical support of Congatex module computer products in China.
About Congatec Conga Technology, a member of the Intel Intelligent Systems Alliance, is headquartered in Deggendorf, Germany, and is a leading supplier of standard embedded computer modules Qseven, COMExpress, SMARC, and provides single-board computers and EDMS custom design services. Konka special products can be widely used in industry and applications, such as industrial control, medical technology, automotive, aerospace electronics and transportation...etc. The company's core and key technologies include unique and rich BIOS features, comprehensive driver and board software support packages. Users in their end product design process are supported through Congatec's extended product lifecycle management and unique modern quality standards. Since its establishment in December 2004, Congatec has become a globally recognized and trusted expert and partner in embedded computer module solutions. Currently Congate specializes in the United States, Taiwan, Japan, Australia, the Czech Republic and China. For more information, please visit our official website.
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