0 Preface
The LED industry chain is generally divided into upper, middle and lower reaches, which are LED epitaxial chips, LED packages and LED applications. As the LED package in the LED industry chain, it plays an indispensable role in the entire industry chain. LED devices are widely used in various applications based on LED devices, such as large LED displays, LED backlights for LCDs, LED lighting, LED traffic lights, and automotive lights. LED devices account for 40% of total product cost. 70, and the performance of LED applications is often more than 70 by the performance of LED devices.
China is a large LED packaging country. It is estimated that 80 LED devices in the world are packaged in China and distributed in various US, Taiwanese, Hong Kong and domestic packaging companies.
In the past five years, foreign LED packaging companies have continued to move to the mainland, domestic packaging companies continue to grow and develop, and technology continues to mature and innovate. In the field of low-end LED device packaging, China's LED packaging companies have a high market share. In the field of high-end LED device packaging, some Chinese companies have made major breakthroughs. With the continuous maturity of process technology and the accumulation of brand reputation, China's LED packaging companies will play an important and leading role in China's LED application country.
These differences are explained below from the various aspects of the LED packaging industry chain.
1 Package production and test equipment differences
LED main packaging production equipment includes solid crystal machine, wire bonding machine, sealing machine, spectrophotometer, dispensing machine, smart oven and so on. Five years ago, LED automatic packaging equipment was basically the world of foreign brands, mainly from Europe and Taiwan. China only has a small supply of semi-automatic solid crystal and wire bonding equipment. In the past five years, China's LED production equipment manufacturing industry has made great progress. Nowadays, automatic die bonding machines, automatic sealing machines, spectroscopic color separation machines, automatic dispensing machines, smart ovens, etc. are available from manufacturers. Good value for money.
LED main test equipment includes IS standard instrument, photoelectric comprehensive tester, TG point tester, integrating ball lumen tester, phosphor tester, etc. and reliability test equipment such as thermal shock, high temperature and high humidity. Except for the standard instruments mainly from Germany and the United States, other equipments are currently produced and supplied by domestic manufacturers.
At present, among the LED packaging companies in China, LED packaging companies in the forefront have the world's most advanced packaging equipment, which is determined by the advantages of latecomers. In terms of hardware level, China's above-scale LED packaging companies are the most advanced in the world. Of course, some of the higher level test and analysis equipment has yet to be further equipped.
Therefore, China has a world-leading level in packaging equipment hardware, with the basis of advanced packaging technology and process development.
2 LED chip difference
At present, there are about 10 LED chip companies in mainland China, which started late and are not large enough. The largest LED chip companies have an annual output value of about 300 million yuan, and the average annual output value of each is between 1 and 200 million.
In the past two years, LED chip companies in mainland China have developed rapidly and their technology level has improved rapidly. Small and medium-sized chips (below 15mils) have been able to meet the needs of domestic packaging companies. Large-size chips (referred to as power-type W-class chips) Imports are also required, mainly from US and Taiwanese companies, but large-size chips can only be used in large quantities after the LEDs enter general illumination.
The performance of LED packaged devices depends on the LED chip by 50. The core indicators of the LED chip include brightness, wavelength, failure rate, antistatic ability, attenuation and so on. At present, most of the small and medium-sized chips of domestic LED packaging enterprises use domestic brands. The chip performance of these domestic brands is small compared with foreign brands, and it has good cost performance and can meet the needs of most LED application companies. In particular, the performance of some chip brands has been comparable to that of foreign brands. Through the cooperation of packaging technology, it has been able to meet the needs of many high-end applications.
3 package auxiliary material difference
Packaging auxiliary materials include brackets, gold wires, epoxy resins, silicones, moldings, and the like. Auxiliary materials are an important basis for the comprehensive performance of LED devices. The quality of auxiliary materials can determine the failure rate, attenuation rate, optical performance, energy consumption, etc. of LED devices.
At present, the supply chain of packaging auxiliary materials in mainland China has been perfected, and most of the materials can be produced and supplied in the mainland. However, high-performance epoxy resin and silica gel are mostly imported. These two types of materials mainly require high temperature resistance, UV resistance, excellent refractive index and good expansion coefficient.
With the process of global integration, Chinese LED packaging companies have been able to apply the latest and best packaging auxiliary materials in the world.
4 package design differences
The LED package form mainly includes three main types: bracket type LED, surface mount type LED and power type LED.
The package design of the LED includes external structure design, thermal design, optical design, material matching design, and parameter design.
The design of the bracket LED has been relatively mature, and it can be further advanced in terms of attenuation life, optical matching, and failure rate.
The design of the SMD LED, especially the top-emitting TOP-type SMD, is constantly evolving. The package size, package structure design, material selection, optical design, and thermal design are constantly innovating, and have broad technical potential.
The design of power LEDs is a new world. As power-type large-size chip manufacturing is still in development, the structure, optics, materials, and parameter design of power-type LEDs are also in the process of development, and new types of designs are emerging.
China's LED package design is based on the design and improvement of existing designs in foreign countries and Taiwan. The design relies on good computer design tools, good test equipment and good reliability test equipment, and needs to be based on advanced design ideas and product comprehension. At present, China's LED packaging design level also has a certain gap with foreign industry giants. This is also related to the lack of large-scale leading enterprises in China's LED industry, and lacks organized and planned large-scale R&D and design investment.