The 13th Summit Forum: Smale talks about where the "Feng" Road is

[Text|High-tech LED reporter Xu Chaopeng] As an important part of LED lighting source, the packaging industry has been in the fast driving and evolution stage of new materials and new technologies in recent years, and currently it is still the packaging companies in Europe, America, Japan, Korea and Taiwan. Domestic LED manufacturers have actively expanded the layout of EMC packaging products in the past 2014.

Among them, the domestic LED packaging factory represented by Simai is particularly obvious in the capacity expansion of EMC products. According to the high-tech reporter, the monthly production capacity of Simai's EMC products has reached 400KK, becoming the domestic EMC packaging. The leader of the industry.

"Compared to the PPA/PCT bracket, the EMC bracket has high heat resistance, UV resistance, high current, small size, and resistance to yellowing, which can bring new choices to LED package manufacturers. Therefore, EMC devices have become our focus. The object of creation.” Stanley Marketing Director Zhang Luhua mentioned.

In addition, EMC packaging has many advantages, high temperature performance will make more indoor lighting using EMC package light source, and its excellent UV resistance is very suitable for outdoor lighting. Moreover, EMC's good stability determines its market share in the bottom backlight.

In the course of the interview, Zhang Luhua constantly emphasized that “EMC has better heat dissipation advantages than COB, and it is likely to bring revolutionary changes in the future. At the same time, EMC packaging products will bring more choices to luminaire design and application. Therefore, it will inevitably push the entire LED industry forward."

Moreover, while actively exploring the EMC packaging market, Smack's eyes have long been seen, and it has begun to lay out higher-level SMC products than EMC. According to the reporter, SMC package is expected to become the next hot spot after EMC in the packaging field.

"SMC package will be applied to flip chip in the future. Especially for the eutectic soldering process, it is necessary to fix the gold-tin alloy on the bracket, which will put higher requirements on the heat resistance of the bracket, so it is more resistant to high temperature SMC. Undoubtedly will play a greater role in this field." Zhang Luhua mentioned.

The 13th Gaogong LED Industry Summit Forum will be held in Langham, Guangzhou on June 8th. At that time, Sloan Marketing Director Zhang Luhua will give a wonderful speech on the latest developments and development trends of the packaging industry on the theme of “Where is the Road” and interact with the participants.

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