Wafers (substrates) sway the cost and performance of SiC power devices. As can be seen on the ICSCRM, many SiC substrate manufacturers are developing 6-inch (150mm) diameter products. The maximum diameter of the power element SiC substrate now produced is 4 inches (100 mm). Increasing the diameter to 6 inches will help improve the production efficiency of SiC power devices and reduce costs.
It is estimated that the earliest 6-inch product can be put into production is the CREE company with the largest market share. The company’s goal is to supply samples in 2011. At this year's ICSCRM, it announced that its work to reduce hollow through defects in 6-inch products is proceeding smoothly. The company not only manufactures power components, but also manufactures blue LED chips using SiC substrates. Therefore, even if the substrate has more crystal defects than the power device SiC substrate, it can be used. That is, the company has the advantage of using 6-inch SiC substrates for LEDs and gradually improving them before they are used in power components.
In addition to Cree, there are many manufacturers are developing 6-inch products. For example, Nippon Steel and Dow Corning of the United States, both companies are targeting the supply of samples in 2012. In addition, the United States Land-based (II-VI) company proposed the sample supply target in 2013.
As can be seen from the above, many SiC substrate manufacturers have turned to the development of 6-inch products. Increasing the caliber to 6 inches can increase the production efficiency of SiC power elements, but the increase in crystal defects leads to a decrease in the yield. Therefore, whether to achieve a large diameter of 6 inches while maintaining the crystal quality of the current 4-inch product will be a watershed for winning or losing.
It is estimated that the earliest 6-inch product can be put into production is the CREE company with the largest market share. The company’s goal is to supply samples in 2011. At this year's ICSCRM, it announced that its work to reduce hollow through defects in 6-inch products is proceeding smoothly. The company not only manufactures power components, but also manufactures blue LED chips using SiC substrates. Therefore, even if the substrate has more crystal defects than the power device SiC substrate, it can be used. That is, the company has the advantage of using 6-inch SiC substrates for LEDs and gradually improving them before they are used in power components.
In addition to Cree, there are many manufacturers are developing 6-inch products. For example, Nippon Steel and Dow Corning of the United States, both companies are targeting the supply of samples in 2012. In addition, the United States Land-based (II-VI) company proposed the sample supply target in 2013.
As can be seen from the above, many SiC substrate manufacturers have turned to the development of 6-inch products. Increasing the caliber to 6 inches can increase the production efficiency of SiC power elements, but the increase in crystal defects leads to a decrease in the yield. Therefore, whether to achieve a large diameter of 6 inches while maintaining the crystal quality of the current 4-inch product will be a watershed for winning or losing.
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