Tokyo, Japan – Renesas Electronics Corporation (TSE:6723), a leading global semiconductor solutions provider, today announced the release of two new sub-gigahertz wireless communication solutions for Wi-SUN-enabled devices. The first solution with automatic dual address filtering will reduce the time required to develop home energy management systems (HEMS), smart meters and other devices.
At the heart of these solutions is the RAA604S00 Wireless Communications System-on-Chip (SoC), a single-chip design that supports communication with smart meters that are essential in HEMS devices and with other home devices. The first Wi-SUN wireless solution uses the RAA604S00 wireless communication SoC with an efficient RX63N 32-bit microcontroller (MCU). The second Wi-SUN wireless solution uses the RAA604S00 SoC with a low-power RL78/G1H 16-bit MCU.
A development environment is also available, including an evaluation board from Tessera Technology Inc. and Renesas' communications control software. This is the world's first solution to combine the evaluation board with RX63N MCU and communication control software for the Wi-SUN Alliance defined Home Area Network (HAN) Certification Test Platform Unit (CTBU). These solutions enable system manufacturers to ensure interconnection with all third-party devices to quickly and reliably develop Wi-SUN-compliant HEMS products.
The new RAA604S00 wireless communication SoC compliant with the Wi-SUN standard and the RL78/G1H MCU integrated with the RAA604S00 and Wi-SUN-compliant products are supported in regions with different frequency bands (eg Europe, North America and ASEAN countries). Change the settings of the wireless communication module to perform sub-Gigahertz band wireless communication.
Key features of the sub-Gigahertz band wireless solution:(1) Renesas' wireless solution is the world's first solution for HAN-certified standard devices compliant with Wi-SUN standards
The solution is equipped with a Wi-SUN-compliant RAA604S00 wireless communication SoC and RX63N MCU evaluation board combined with communication control software, and is now used as a standard device for testing Wi-SUN-compliant HAN certified interconnectivity. The solution ensures interoperability with all third-party devices, simplifying the user product certification process and helping to reduce development time.
(2) The world's first dual address filtering solution helps reduce development time and provide more stable communication. The Wi-SUN-compliant RAA604S00 wireless communication SoC is integrated on a single chip and automatically filters two communication addresses. Use software to filter unnecessary processing, thus reducing development time. Even in the future, when the number of wireless communication devices in the sub-gigahertz band increases, resulting in a crowded communication environment, filtering can be completed without delay, preventing system instability. The chip consumes less power, with a receive current of 6.1 mA during Wi-SUN communication and a standby current of 5.8 mA (typically Vcc = 3.3 V). This feature helps extend battery life and enables smaller batteries in battery-powered devices.
(3) Two solutions are provided: one is a Wi-SUN communication SoC equipped with an RX63N 32-bit MCU, and the other is an RL78/G1H equipped with an on-chip Wi-SUN.
Renesas offers two new solutions: the first high-performance solution uses the RAA604S00 wireless communication LSI with the RX63N 32-bit MCU in accordance with the Wi-SUN standard, and the other solution is the RL78/G1H with Wi-SUN communication. Low power 16-bit MCU. The solution to combine the RAA604S00 with the RX63N MCU has been certified for performance in HAN (home network) and in the HEMS controller and Wi-SUN for Echonet Lite Profile (Wi-SUN Alliance) , Note 3) International wireless communication between smart meters. Because the solution uses PHY, MAC and network (6LoWPAN, IPv6) layers and security verification (PANA), it can quickly form a system that supports ECHONET Lite. In addition, the solution using the RL78/G1H will be certified in January 2016. In the development environment, Tessera Technology Inc. provides an evaluation board with an RX63N 32-bit MCU, an external RAA604S00 wireless communication SoC, and an evaluation board with an RL78/G1H 16-bit MCU. Renesas also provides communications software for these evaluation boards to help reduce the time required for certification and development.
In addition to providing the new sub-Gigahertz band wireless communication solution described above, Renesas Electronics is working to expand its lineup of near-field wireless communication solutions to support technologies such as Bluetooth Low Energy (BLE). Renesas Electronics is also actively involved in the field of power line communication (PLC) for electric meters and HEMS equipment.
Price and availabilitySamples of the Wi-SUN-compliant RAA604S00 wireless communication SoC and the Wi-SUN-compliant RL78/G1H low-power 16-bit MCU are currently available. The Wi-SUN-compliant RAA604S00 wireless communication SoC is priced at $2.50, and the Wi-SUN-compliant RL78/G1H low-power 16-bit MCU is priced at $6.00. SoC plans to begin mass production in January 2016, while the Wi-SUN-compliant RL78/G1H low-power 16-bit MCU is scheduled to begin mass production in April 2016.
The RX63N MCU is also currently available, and Tessera Technology Inc. has launched an evaluation board based on its development environment. Renesas Electronics has released a trial version of the communications software, the official version is expected to be released in December 2015. (Prices and availability are subject to change without notice.)
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