In general, 99.99% pure gold wire is used as a solder material in packaging processes such as IC, LED, and CMOS. With the continuous rise of international gold prices in recent years, the price of gold wire as welding consumables has also risen, and the production cost of enterprises has remained high. In this context, many manufacturers are trying to develop wires such as copper alloys and silver alloys instead of gold wires.
The gold wire plays a wire connection role in the LED package, that is, the surface electrode of the chip and the bracket are connected. When the current is turned on, the current enters the chip through the gold wire, so that the chip emits light. Gold wire has the characteristics of large electrical conductivity, corrosion resistance, good toughness and excellent oxidation resistance. It has always been an indispensable material for LED packaging. But considering the cost issue, many packaging factories have begun to look for alternative materials for gold wire. Liu Sheng, director of the Microsystems Research Center of Huazhong University of Science and Technology, pointed out that in the LED packaging process, the electrical connection between the LED chip and the package holder is mainly achieved by the pressure welding process. LED packaging companies generally use gold wire bonding, but gold wires are expensive, resulting in higher LED costs. He established a model through the finite element method to analyze and compare the gold wire and copper wire bonding processes in high-power LED packages. He believes that copper wires are inexpensive and have great application potential in reducing costs.
Recently, at the 7th Guangzhou International LED Exhibition, some companies have demonstrated their use in LED packaging, which is different from traditional alloy wires. Hu Xiaoli, chairman of the board of directors of Guanfu Group (Hong Kong) Co., Ltd., said that there is a trend in the market to replace gold wires with silver alloy wires. This alloy wire is made of ≥99.9998% high-purity silver material by adding trace alloys and elements. After gold plating and composite treatment, the single crystal structure is quite stable. Its hardness and other performance parameters are equivalent to the gold wire, and in the electrical and thermal conductivity characteristics, even higher than the gold wire about 30% -35%. She said that at this exhibition, many packaging factories have contacted them to deal with related products, but at present, this gold-plated silver-based alloy wire is produced in only a few manufacturers in China.
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