For closed electronic equipment, combining engineering theory and numerical methods, an equipment-level modeling and simulation method can be established to improve the efficiency of thermal analysis. The influence of the heat transfer path and related parameters on the temperature field of the equipment is studied in conjunction with a calculation example, which has a guiding and reference significance for the thermal design of electronic equipment. Simulation modeling method. The object describes a typical closed electronic device structure. The system contains multiple sets of PCB boards and various components. Each set of boards is installed in a closed shell space. The heat generated by the system is transferred to the shell through the convection heat transfer and heat conduction of the air in the cavity, and then through the shell. The heat is lost to the environment.
Because of the isolation between the internal and external environments of the device, there is no traditional fan and other heat sinking devices, and the thermal design requirements of the product are higher. PCB board modeling uses a relatively simplified processing method for device-level products. According to the thickness of copper and the coverage of copper wire, an anisotropic thermal conductivity material is generated to simulate the PCB board. In the calculation model, replace the CPU with a metal block, give its heating power, and specify the material thermal conductivity at the same time. In addition to the CPU, the heat generated by other chips is relatively small. In the modeling process, heat sources and metal blocks are also used to simulate.
Heat sink modeling Heat sinks are generally connected to components with larger heating power to increase the efficiency of heat loss. Enclosure modeling Enclosed electronic equipment enclosures are made of metal materials and have a certain thickness. Solid metal domains are used in modeling. Parameters such as material density, thermal conductivity, and specific heat capacity need to be set. Other devices, such as capacitors, small resistors, and other devices with small structure sizes and small heat generation, are not considered in equipment-level simulation modeling to simplify modeling and reduce the difficulty of meshing.
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