Intel motherboard problems continue CPU trouble

Beijing time on October 10, according to foreign media reports, Intel's new four-channel memory support in the high-performance Sandy Bridge-E processor has brought a lot of trouble to the motherboard manufacturers. These vendors are considering how to include support for large CPU coolers without sacrificing performance.

When Intel planned to develop the Sandy Bridge-E architecture, one of the most important improvements it wanted to achieve was to increase support for higher memory bandwidth. To achieve this goal, Intel increased the number of memory channels the processor can support and decided to use a four-channel architecture. Theoretically, this improvement can increase bandwidth by more than 33% compared to a three-channel memory controller (used in Nehalem), but adding a fourth memory channel is not as simple as imagined.

The biggest hurdle for Intel is to optimize the motherboard to maintain redundant continuity between the four DIMMs. This requires that all DIMM sockets and CPU socket must be the same distance. Therefore, the position of the main board components needs to be redesigned. This design has caused many problems for the CPU heat sink.

At the same time, the problem is not limited to a motherboard manufacturer, and all manufacturers participating in the LGA 2011 motherboard design will be greatly affected.