Theme: Industry Recently, Sun Yat-sen University and Shenzhen Shenhualong Technology Industrial Co., Ltd. held the signing ceremony of “Zhongshan University-Shenhualong LED Package Micro-integrated Technology (Shenzhen) Joint Laboratoryâ€.
Shen Jiaxiong, CEO of Shenzhen Hualong Industrial Co., Ltd. confidently said, “In the future, we will have more confidence and market competitiveness will be strengthened.†With the rapid development of enterprises, the limitations of relying solely on internal resources for technological innovation are growing. The cooperation between industry, academia and research institutes, through the use of external cooperation resources to achieve technological innovation, has become a major factor in the Shenzhen LED industry, and has become another wing of the Shenzhen LED industry. Sun Yat-Sen University-Shenhualong LED Package Micro-integrated Technology (Shenzhen) Joint Lab is headquartered in Shenzhen, and its branch office is located at the Institute of Optoelectronics and Composite Functional Materials of Sun Yat-Sen University. The cooperation mainly involves new silicon substrate LED packaging technology. Based on this, the development of large-size LED backlight templates and the research on the common problems of LED packaging.
Shen Jiaxiong, CEO of Shenzhen Hualong Industrial Co., Ltd. confidently said, “In the future, we will have more confidence and market competitiveness will be strengthened.†With the rapid development of enterprises, the limitations of relying solely on internal resources for technological innovation are growing. The cooperation between industry, academia and research institutes, through the use of external cooperation resources to achieve technological innovation, has become a major factor in the Shenzhen LED industry, and has become another wing of the Shenzhen LED industry. Sun Yat-Sen University-Shenhualong LED Package Micro-integrated Technology (Shenzhen) Joint Lab is headquartered in Shenzhen, and its branch office is located at the Institute of Optoelectronics and Composite Functional Materials of Sun Yat-Sen University. The cooperation mainly involves new silicon substrate LED packaging technology. Based on this, the development of large-size LED backlight templates and the research on the common problems of LED packaging.
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