According to the Institute for Industry and Information Technology (MIC), the growth momentum of the global semiconductor market slowed down in 2011. Under the influence of the 311-magnitude earthquake in Japan, the semiconductor market experienced unusual volatility, coupled with the European and American debt crisis, resulting in the third quarter. The phenomenon of weak peak season and quarterly recession also reduced the visibility of the industry in the second half of the year. It is expected that the semiconductor industry will be highly affected by external uncertainties and will continue into the first half of 2012.
According to MIC's estimates, the global semiconductor market is still expected to grow by 4.2% in 2011 driven by the growth of smart mobile devices, and it is expected that the global semiconductor market will achieve another 4.1% growth in 2012.
Taiwan’s semiconductor industry’s 2011 total industrial output value is expected to decline by 6.2% from 2010, reaching NT$1.52 trillion. According to Hong Chunhui, deputy director of the MIC Policy Council, the main cause of the recession is the impact of exchange rate changes, IC design growth slowdown, and the decline of the memory industry. In terms of IC design, due to Taiwan's relatively slow pace in launching new products for smart mobile device IC applications, the industry lacked significant growth momentum. In 2011, the output value reached NT$410.6 billion, a 7.4% decline from 2010.
In the foundry industry, the industry first encountered the East Japan Earthquake, and later encountered European debt and other external uncertainties, leading to abnormal business climate fluctuations. However, with the increase in the proportion of customers' high-level processes, the third quarter of 2011 can be operated. Looking beyond the expected performance, the 2011 output value is still expected to remain flat and grow slightly compared to 2010, reaching NT$543.9 billion.
Taiwanese memory companies continued to suffer losses due to falling prices of DRAMs. Due to the impact of production cuts or restructuring, the output value of the Taiwanese manufacturers fell rapidly. In terms of packaging and testing, affected by the East Japan 311 earthquake and disrupting the order of the semiconductor supply chain, the second quarter and third quarter revenues and IC manufacturing revenues for packaging and testing plants have a different phenomenon. Overall, the output value of IC packaging industry in Taiwan in 2011 still reached NT$367.9 billion, a 4.6% increase from 2010.
Looking ahead to 2012, SMC believes that in addition to the memory industry, the outlook for Taiwan's semi-conductor industry is still positive, except for the impact of the debt crisis in Europe and the United States, which is conservatively estimated at an annual growth rate of approximately 2.7%. The overall output value is approximately NT$1.56 trillion. In the IC design industry, Taiwanese companies are expected to make a profit in the low-cost smartphone market and regain their growth momentum.
In terms of wafer foundry, as the leading industry's 22nm production capacity is gradually opened, the proportion of high-level process manufacturing is expected to grow. Taiwan's foundry industry should be better than the global semiconductor average performance in 2012. Taiwan's memory companies, especially DRAM products, are still limited by their lack of competitiveness in product specifications, and they may continue to cause changes or cuts in related industries. This will cause Taiwan's memory industry output value to continue to decline.
In terms of packaging and testing, the major growth momentum will come from the release of European and American international integrated manufacturers (IDM) and consumer demand in emerging countries, but the DRAM production cut effect will reduce the growth momentum, in addition, the volatility of gold prices will be to sealers The impact of the operation and profitability is worth continuing observation.
According to MIC's estimates, the global semiconductor market is still expected to grow by 4.2% in 2011 driven by the growth of smart mobile devices, and it is expected that the global semiconductor market will achieve another 4.1% growth in 2012.
Taiwan’s semiconductor industry’s 2011 total industrial output value is expected to decline by 6.2% from 2010, reaching NT$1.52 trillion. According to Hong Chunhui, deputy director of the MIC Policy Council, the main cause of the recession is the impact of exchange rate changes, IC design growth slowdown, and the decline of the memory industry. In terms of IC design, due to Taiwan's relatively slow pace in launching new products for smart mobile device IC applications, the industry lacked significant growth momentum. In 2011, the output value reached NT$410.6 billion, a 7.4% decline from 2010.
In the foundry industry, the industry first encountered the East Japan Earthquake, and later encountered European debt and other external uncertainties, leading to abnormal business climate fluctuations. However, with the increase in the proportion of customers' high-level processes, the third quarter of 2011 can be operated. Looking beyond the expected performance, the 2011 output value is still expected to remain flat and grow slightly compared to 2010, reaching NT$543.9 billion.
Taiwanese memory companies continued to suffer losses due to falling prices of DRAMs. Due to the impact of production cuts or restructuring, the output value of the Taiwanese manufacturers fell rapidly. In terms of packaging and testing, affected by the East Japan 311 earthquake and disrupting the order of the semiconductor supply chain, the second quarter and third quarter revenues and IC manufacturing revenues for packaging and testing plants have a different phenomenon. Overall, the output value of IC packaging industry in Taiwan in 2011 still reached NT$367.9 billion, a 4.6% increase from 2010.
Looking ahead to 2012, SMC believes that in addition to the memory industry, the outlook for Taiwan's semi-conductor industry is still positive, except for the impact of the debt crisis in Europe and the United States, which is conservatively estimated at an annual growth rate of approximately 2.7%. The overall output value is approximately NT$1.56 trillion. In the IC design industry, Taiwanese companies are expected to make a profit in the low-cost smartphone market and regain their growth momentum.
In terms of wafer foundry, as the leading industry's 22nm production capacity is gradually opened, the proportion of high-level process manufacturing is expected to grow. Taiwan's foundry industry should be better than the global semiconductor average performance in 2012. Taiwan's memory companies, especially DRAM products, are still limited by their lack of competitiveness in product specifications, and they may continue to cause changes or cuts in related industries. This will cause Taiwan's memory industry output value to continue to decline.
In terms of packaging and testing, the major growth momentum will come from the release of European and American international integrated manufacturers (IDM) and consumer demand in emerging countries, but the DRAM production cut effect will reduce the growth momentum, in addition, the volatility of gold prices will be to sealers The impact of the operation and profitability is worth continuing observation.
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